Thermoelectric device and system

专利摘要:
THERMOELECTRIC DEVICE AND SYSTEM. The present disclosure relates to thermoelectric devices that may be useful for a wide range of thermoelectric applications, for example, high temperature thermoelectric generation and fluid conditioning. Thermoelectric devices may include one or more heat exchangers (eg, refrigerant heat exchanger(s)) and one or more thermoelectric layers located adjacent (eg, on opposite sides) of the heat exchanger(s). The thermoelectric layer(s) and heat exchanger(s) may be surrounded by an enclosure, which provides a barrier against external fluid (eg hot fluid flow). The enclosure can thermally conduct heat between the external environment and the thermoelectric layer(s). In some cases, the heat exchanger(s) may be spaced from and movable relative to the inner wall of the enclosure (e.g. sliding), which can accommodate the thermal expansion effects that arise between the heat exchanger(s). and the wrapper. The housing may include a conformal surface adapted to substantially correspond with the shape of the thermoelectric layer(s), for example with the application of a vacuum. One or more thermally conductive members (eg heat conducting fins) may (...).
公开号:BR112015022574B1
申请号:R112015022574-8
申请日:2014-03-15
公开日:2022-01-25
发明作者:Steven Casey
申请人:Vecarius, Inc；
IPC主号:

专利说明:

FIELD
[001] Aspects of the present disclosure generally refer to apparatus and methods that can be used in cooperation with thermoelectric systems. DISCUSSION OF RELATED TECHNIQUE
[002] Thermoelectric generators are devices that convert thermal energy, which arises from a temperature difference, into electrical energy using a phenomenon called the “Seebeck effect”.
[003] Due to their ability to convert thermal energy produced by a temperature difference directly into electricity within a compact solid state form, thermoelectrics have received a significant amount of attention. For example, thermoelectrics can be useful for efficiently recovering waste heat at high temperatures from energy intensive platforms such as combustion engines in automobiles.
[004] Conventional TEG systems pose challenges, particularly at high temperatures due to the effects of thermal expansion, resulting in difficulties in reliability, packaging (eg, size, weight, versatility) and performance. Additionally, these challenges often lead to system designs that require higher levels of complexity to be viable, which also increases cost. SUMMARY
[005] The present disclosure relates to new designs of a thermoelectric device and optional aspects for a wide range of applications, particularly those related to thermoelectric generation at high temperatures, although applications for modalities presented here may involve fluid conditioning as well. . The unique designs described are able to overcome or avoid several challenges confronting existing thermoelectric systems that limit market acceptance in terms of system performance, mobility (size, weight, reliability), versatility and cost.
[006] In one embodiment, a thermoelectric device is presented. The device includes at least one heat exchanger; at least one thermoelectric layer in thermal communication with the at least one heat exchanger and a housing surrounding the at least one thermoelectric layer and the at least one heat exchanger, the housing providing a barrier to the at least one thermoelectric layer and the at least at least one fluid heat exchanger located outside the housing, wherein a portion of the housing is adapted to conduct heat and is in thermal communication with the at least one thermoelectric layer, and wherein the at least one heat exchanger is spaced apart and movable relative to an inner surface of the housing to accommodate thermal expansion of the at least one heat exchanger and the housing.
[007] In another embodiment, a thermoelectric system is presented. The system includes a duct defining a flow space which houses a stream of fluid flow, the duct having an inlet arranged to accommodate the entry of fluid into the flow space and an outlet arranged to accommodate the exit of fluid from the flow space and a thermoelectric device disposed within the flow space. In related embodiments, noise dampening components may be provided in connection with thermoelectric device embodiments, for example within the flow space of ducts.
[008] In another embodiment, a thermoelectric structure is presented. The structure includes a heat exchanger having an inlet, an outlet and channels adapted to route fluid flow between the inlet and outlet; a first thermoelectric layer rigidly secured to a first side of the heat exchanger and a second thermoelectric layer rigidly secured to a second side of the heat exchanger opposite the first side.
[009] In another embodiment, a heat exchanger is presented. The heat exchanger includes a conformal surface adapted to substantially correspond with the shape of a structure disposed adjacent the surface and a plurality of thermally conductive members extending from, surrounding and in contact with an outer region of the conforming surface, the plurality of members. thermally conductive adapted to transfer heat between the conforming surface and a surrounding environment.
[010] In one mode, a thermal switch is presented. The thermal switch includes a channel separating a first structural component and a second structural component and a fluid composition contained within the configured channel such that the thermal conductivity between the first and second structural components changes as the fluid composition changes at phase between liquid and vapor at its boiling temperature.
[011] In yet another embodiment, a composite of the thermal interface is presented. The thermal interface composite includes a conformal surface lamina adapted to substantially correspond with a shape of a structure disposed adjacent the surface and a composition disposed on at least one side of the lamina surface accordingly producing higher thermal conductivity across a formed interface. between two components in contact with and arranged on opposite sides of the sheet surface conforming than without the composition.
[012] Advantages, new aspects and objects of the present disclosure will become evident from the following detailed description when considered in conjunction with the accompanying drawings, which are schematic and which are not intended to be drawn to scale. For purposes of clarity, not every component is labeled in each figure, nor is every component of each embodiment shown where illustration is not necessary to enable those skilled in the art to understand aspects of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS
[013] The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures is represented by a similar numeral. Various embodiments of the present disclosure will now be described, by way of example, with reference to the accompanying drawings.
[014] Figure 1 illustrates a perspective view with a partial cutout of the upper ceramic of a thermoelectric module device,
[015] Figure 2 shows a cross-sectional view of the thermoelectric device of figure 1,
[016] Figure 3 shows a perspective view of a thermoelectric device according to some modalities,
[017] Figure 4 illustrates a cross-sectional view of the thermoelectric module device of figure 3,
[018] Figure 5 shows a perspective view of another thermoelectric device according to some modalities,
[019] Figure 6 shows a cross-sectional view of a side plane through the thermoelectric device of figure 5,
[020] Figures 7 and 8 illustrate a perspective view of yet another thermoelectric device according to some embodiments,
[021] Figure 9 represents an arrangement of fins in strips according to some modalities,
[022] Figure 10 shows a cross-sectional view of the thermoelectric layer surfaces interacting with a finned conforming shell, schematically illustrating the thermal deflections during operation, where the deflections shown as enlarged to illustrate the concept visually,
[023] Figure 11 represents a view of the concept of the longitudinal cross section of the modality of Figure 5 and schematically shows the effects of thermal expansion according to some modalities,
[024] Figure 12 illustrates a cross-sectional view of a two-stage high temperature thermoelectric module device according to some embodiments,
[025] Figure 13 illustrates a side cross-section view of another thermoelectric device according to some modalities,
[026] Figure 14 represents a close perspective view of thermoelectric modules in contact with a heat exchanger according to some modalities,
[027] Figure 15 illustrates a side cross-section view of another thermoelectric device according to some modalities,
[028] Figure 16 shows a side cross-sectional view of a thermoelectric device with a compressible casing side wall, according to some embodiments,
[029] Figure 17 represents concept views of an interior volume, whereby the arrows and the substantially cuboid shape represent an example of the outermost lateral dimensions of a duct space,
[030] Figure 18 shows a perspective view of a thermoelectric system according to some modalities, whereby a thermoelectric device is located within the duct space,
[031] Figure 19 represents a view of a cuboid-shaped enclosure according to some embodiments, along with a cross-sectional view close to a side wall,
[032] Figure 20 shows close cross-sectional views of various cuboid-shaped housings according to some embodiments,
[033] Figure 21 shows a table of some types of noise dampening aspects and some characteristics for silencer systems according to some modalities,
[034] Figure 22 represents a perspective view of a thermoelectric silencer system according to some embodiments,
[035] Figure 23a illustrates a cross-sectional view of a thermoelectric silencer system according to some embodiments,
[036] Figure 23b illustrates a longitudinal/axial cross-sectional view of a thermoelectric silencer system with an inlet reactive chamber extended at the top and bottom according to some embodiments,
[037] Figure 23c illustrates a longitudinal/axial cross-sectional view of a thermoelectric silencer system with a medium-length reactive chamber according to some embodiments,
[038] Figure 23d illustrates a side cross-sectional view of a thermoelectric silencer system involving an outlet tube and a plurality of devices within a duct according to some embodiments,
[039] Figure 23e illustrates a longitudinal/axial cross-sectional view of a thermoelectric silencer system with a plurality of general thermoelectric devices with noise dampening arrangements surrounding them within a flow space in accordance with some embodiments,
[040] Figure 24 shows a perspective view of a vertically stacked thermoelectric system according to some modalities,
[041] Figure 25 represents a perspective view of the horizontally stacked thermoelectric system according to some modalities,
[042] Figure 26 shows a cross-sectional view of a thermoelectric device according to some modalities,
[043] Figure 27 illustrates channel grooves along a blade, along with a cross-section close to a thermal switch according to some embodiments and
[044] Figures 28a and 28b illustrate a close cross-sectional view of the fluid channels contained in a thermal switch according to some embodiments. DETAILED DESCRIPTION
[045] The present disclosure relates to thermoelectric devices that may have an architecture that may be useful for a variety of applications, including thermoelectric generation (e.g., a combustion engine exhaust system including, but not limited to, those in vehicles) and fluid conditioning (e.g. heating and cooling fluids). Various embodiments of thermoelectric devices in accordance with the present disclosure are capable of performing thermoelectric conversion between thermal and electrical energy.
[046] Certain embodiments of the thermoelectric devices and systems described here are capable of operating reliably, for example, as thermoelectric generators (TEGs), drawing energy from a thermal gradient produced, at least in part, from a fluid at high temperature (e.g. example, up to 700 degrees C and higher) located on a “hot side” of the device. As such, embodiments of the present disclosure may allow large temperature differences to exist between the "hot side" and "cold side" of a TEG, which generally allows for stable production of electrical power. Operation of such devices may allow heat transfer from a hot fluid to a comparatively cooler fluid via a novel component heat exchange system that incorporates thermoelectric materials that can be used to convert a portion of the transferred heat directly to electricity.
[047] In some embodiments, a thermoelectric device includes one or more heat exchangers in thermal communication with one or more thermoelectric layers. The heat exchanger(s) may include an inlet, an outlet and channels adapted to route fluid flow therethrough. In some cases, thermoelectric layers may be arranged on opposite sides of the heat exchanger(s). The thermoelectric layer(s) may or may not be rigidly attached to the heat exchanger(s).
[048] An enclosure may encircle the thermoelectric layer(s) and heat exchanger(s), producing a fluid barrier (eg hot flow stream) located outside the enclosure. In some embodiments, the housing may itself behave as a heat exchanger and may thermally conduct heat between the external environment and the thermoelectric layer(s). In some embodiments, the heat exchanger(s) may be spaced from and movable with respect to the inner wall of the enclosure, which can accommodate the effects of thermal expansion arising between the heat exchanger(s) and the enclosure.
[049] As described here, the housing of a thermoelectric device can act as a heat exchanger. In some embodiments, a heat exchanger (e.g., surrounding other components, such as thermoelectric layers or other heat exchangers) may include a conformal surface adapted to substantially match the shape of a neighboring structure (e.g., thermoelectric layer arranged adjacent to it). In some embodiments, the conforming surface may include a suitable composition that serves to increase the thermal conductivity of the conforming surface. The heat exchanger may further include one or more structural members (e.g., heat conducting fins) extending therefrom, which may be suitable for transferring heat between the conforming surface and the surrounding environment.
[050] Conventional thermoelectric modules for electrical generation used in low to moderate temperature applications (typically < 275 degrees C on the hot side) are relatively thin planar devices similar to the one shown in Figure 1. The module shown in Figure 1 is composed of a series of thermocouples, each including n-type 1 and p-type 2 thermoelectric materials electrically connected by metallic interconnects 3. A plurality of these pairs are interconnected forming an electrical circuit, producing electricity when heat flows through the pairs. The flow of heat is driven by a temperature difference between the hot and cold sides of the pairs (eg module).
[051] The circuit of figure 1 is electrically isolated on opposite sides, which is often performed by providing mechanically coupled ceramic substrates in the metallic interconnections. The process of mechanically coupling ceramic substrates to metallic interconnections, called metallization, involves rigidly attaching a ceramic substrate to the hot side (which appears cut out in Figure 2, so the circuit layout is visible) and another ceramic substrate to the cold side of the circuit. A cross-sectional view of a conventional thermoelectric module is also shown in figure 2. Such thermoelectric modules are solid state and lack moving parts.
[052] However, the high temperatures of such applications pose significant challenges to satisfy the performance, mobility (ie, compact, lightweight, reliability) and cost requirements for modules, devices and systems that incorporate thermoelectrics. For example, as shown in figures 3 and 4, a conventional high temperature thermoelectric module (>300 degrees C for hot side temperature) often requires high performance thermoelectric materials 6, 7 to perform at high temperatures. Thermoelectric modules also often require a single hot side ceramic 5 for each thermocouple in order to compensate for the significant thermal expansions and stresses incurred from the substantial temperature gradient produced between the hot side and the cold side. As shown in figure 3, for this embodiment, the upper side 5 and the lower side 4 represent the hot and cold sides, respectively. In addition, most thermoelectric materials at such higher temperatures often require operation within an inert environment to protect them from oxidation, typically requiring a sealed enclosure within a device or system.
[053] Conventional thermoelectric generator (TEG) systems often involve a refrigerant heat exchanger and thermoelectric materials that are arranged outside a duct that confines the flow of hot gas. These TEG systems are also heavily integrated into the duct, whereby the system is tightly locked into the duct. The duct is used as a hot side heat exchange base surface to which the fins are attached. Heat is transferred through the fins and duct from the hot fluid to thermoelectrics located outside the duct and finally rejected through the refrigerant heat exchanger. Typically, these systems include an outer casing together with the duct and other components, forming a cavity or casing, which contains and protects the thermoelectrics and refrigerant heat exchanger from the outside environment.
[054] As discussed above, several problems arise when implementing conventional thermoelectric systems, particularly at high temperatures. However, thermoelectric devices and systems according to the present list overcome many of the problems associated with traditional thermoelectric systems.
[055] Although the modalities described here, in many cases, describe devices and components in the context of power generation, the thermoelectric devices presented here can also be adapted for conditioning a fluid equally, for cooling or heating, which, in In some cases, it can affect the overall temperature and/or chemical reaction tendency of a fluid. For fluid conditioning applications, electricity can be used to energize thermoelectric materials to direct thermal energy to or from the fluid. Such adaptations may utilize certain modalities that include device architectures in accordance with those disclosed herein.
[056] Various embodiments of thermoelectric devices, as well as their components, may include any suitable shape, for example, cuboid, cubic, cylindrical or other shapes or combinations thereof. One embodiment of a thermoelectric device that lends itself to compactness is a device having a small-profile rectangular cuboid shape, as illustratively shown herein.
[057] It can be seen that, as presented here, a shape that is substantially similar to a rectangular cuboid is not required to exhibit strict attributes of a cuboid. For example, respective edges and corners of the rectangular cuboid may exhibit gradual transitions (eg, rounded, conical, chamfered, etc.) and other features such as depressions, transitions, notches, fins, indentations, bulges, etc. can be displayed anywhere, which can deviate from the strict attributes of a cuboid. Such shapes may have any suitable dimensions, whether they are aspects within or along the cuboid or on its periphery.
[058] In various embodiments, as discussed above, the architecture of the thermoelectric device includes a housing, wherein a portion of the housing transfers heat between a hot fluid surrounding the device and the internal components within the housing. The housing, which itself is composed of one or more components, defines an enclosure that provides a protective barrier to the internal components within the enclosure against hot fluid located outside and surrounding the enclosure. In some cases, the surrounding fluid might not be the only source of heat, as combustion or other high-temperature heat sources can emit significant thermal radiation to radiate the device.
[059] In some embodiments, the thermoelectric device includes a gas-tight housing, however, it may be noted that strictly gas-tight housings are not required for each housing embodiment. The components that make up the housing can function as a protective barrier or, in addition, they can be used for other purposes of the device (eg heat transfer, thermal interfacing with the internal thermoelectrics, structural support, etc.). Additionally, the housing may compensate for or otherwise accommodate thermal expansion between the components of the assembly, which may arise from temperature gradients across it, for example, between the interior of a closed heat exchanger and the exterior of the housing.
[060] In certain embodiments, the housing surrounds at least one thermoelectric layer composed of thermoelectric materials which in turn surround a portion of at least one refrigerant heat exchanger. The cold side of the thermoelectric layer can be in thermal communication with the refrigerant heat exchanger while the hot side of the thermoelectric layer can be in thermal communication with a portion of the housing. In addition to including surfaces that are thermally conductive and thermally communicate with the thermoelectric layer, the refrigerant heat exchanger may also include inlet and outlet communicating tubes to control flow in and out of the heat exchange section(s). with refrigerant and the extension to the communication tubes (or piping) to route the flow of refrigerant to and through the wall of the enclosure.
[061] Although the internal components of the housing are contained within the housing, these components, in some embodiments, do not need to be substantially trapped in the housing (described in more detail below). For example, the heat exchanger may be spaced from and movable from much of the inner surface of the housing to accommodate thermal expansion of the heat exchanger and housing. Additionally, the outer surface of the housing may optionally include structural components/members (e.g., a plurality of fins extending from the housing) that can enhance heat transfer between the housing and fluid located outside the housing.
[062] In some embodiments, the architecture of the thermoelectric device includes components substantially resembling low-profile planar shapes (eg, substantially flat and relatively short in height) and is illustratively shown in Figures 5 to 8. Figure 5 illustrates fluid flow over and around a cuboid thermoelectric device 50.
[063] In some embodiments, the thermoelectric device 50 includes a housing 51 with an inner surface on which the thermoelectric layers 63 are disposed. The thermoelectric layers may surround, on opposite sides, a small profile refrigerant heat exchanger 64, which includes one or more substantially flat heat exchange sections. The shape of the heat exchange section(s) can allow for an overall housing shape substantially similar to a small profile rectangular cuboid. A shape that is short in profile is one in which its width and length, which may or may not be the same, are substantially greater than its height, often greater than a factor of two; factors from 5 to 20 may be common.
[064] The flow of refrigerant enters the housing through an inlet 52 and leaves through an outlet 53 and is routed to the internal components of the heat exchanger (e.g. routing tubes, communication tubes, heat exchanger component(s)). heat exchange). Electrical wiring (i.e., for thermoelectric power, control, sensing) may be routed through the housing into an electrical wiring hole 54 and to the thermoelectric layers and any other control or sensing components within the housing.
[065] Fins 55 can be included on opposite sides of the housing to increase heat transfer from a hot fluid that surrounds and flows over the thermoelectric device. The fins can be designed to be of a shape and pattern that satisfy certain requirements for a desired application. It can be verified that the fin design represented in the figure is generic and not necessarily a preferred modality. In a motor vehicle exhaust system, for example, the fin density would generally not be so high that excessive pressure drop would incur, increasing the back pressure at the engine outlet and ultimately reducing the engine's efficiency. However, too small a fin density can generally result in lower housing temperatures for a given hot fluid temperature, resulting in a reduction in the output performance of the thermoelectric device.
[066] Several options of fin models can be used, for example, with shutter, strip, lancet, offset, perforated, etc. The fins may be adapted to extend outside portions of the housing and may optionally display different cross-sectional areas, patterns or geometry along the housing for the same device. The fins may be formed as an integral part of the housing (e.g., extruded housing with fins) or joined as separate finned components on a portion of the housing surface.
[067] Figure 6 represents a cross-sectional view through a side plane of an embodiment of a thermoelectric generator, showing the internal components within the housing, as well as the fins 55 extending outward from the upper and lower surface of the housing. Figure 6 illustrates substantially symmetrical geometry around the horizontal plane represented by the dotted line. (In Figure 6, the lower fins are mostly hidden from view for internal visibility.)
[068] Housing 51 contains power generating components including two thermoelectric layers 63, each disposed on two opposite sides of the refrigerant heat exchange section 64. The refrigerant heat exchange section 64 is cooled by the refrigerant fluid. flowing through passages 65 (e.g., channels that extend in and out and perpendicular to the plane of the cross-sectional view) and in turn cools the cold side portion of the thermoelectric layers 63.
[069] As evident in the figure, this architecture results in substantial symmetry around a horizontal plane that extends through the center of the refrigerant heat exchanger. This symmetry produces a relatively simple and compact architecture and also plays a role in keeping device interface assemblies flat, for example, significantly reducing out-of-level effects due to the mechanical stresses of thermal expansion, which can occur due to large temperature gradients. temperature across the assembly (from the hot shell to the cold heat exchanger) within such a compact structure, discussed further below.
[070] The housing also includes the base 61 blades (or plates) which, in some embodiments, can pinch and compress the internal components on opposite sides of the internal architecture, creating contact pressure at the component interfaces. The hot side portion of the interface of the thermoelectric layers 63 can, for example, be thermally coupled with the base blades of the housing 61. As further shown, a peripheral space 67 is provided over which the base blades of the housing 61 extend. or overhang, which is walled off by a side wall 62. In some embodiments, that side wall 62 extends a distance between the upper and lower base blades 61. The side wall may be in contact with, may be secured to (e.g. (e.g. adhered, joined, clamped, clamped, welded, brazed) or may be integrally formed with one or more of the laminae (e.g. extruded, stamped, drawn) of housing 51.
[071] Various sidewall arrangements may depend on the type of enclosure used (as discussed later). In some embodiments, the space 67 contains additional components that isolate the interiors from the periphery (eg, radiation barrier, insulation, etc.) and/or complement the type of enclosure used (as discussed further below).
[072] A general layout of the internal components is shown in figures 7 and 8 and may reside within the housing 51 (the housing is shown to be transparent in these figures so that the internal components are visible). After the refrigerant fluid enters the housing through the inlet 52, the refrigerant fluid is directed through the inlet communication tube 66 into the passages 65 within the refrigerant heat exchange section 64. The refrigerant fluid facilitates the transfer of heat ( e.g. by convection) away from the heat exchange section 64, which is in contact with the thermoelectric layers 63 that surround the upper and lower surfaces of the heat exchange section 64, resulting in thermal communication between them. The refrigerant fluid flows into the outlet communicating tube 67, resulting in an exchange of heat flowing backwards through the TEG, where the hot fluid over the housing flows in an opposite direction. It can be seen that the flow of refrigerant can also be directed to flow in the opposite direction if desired. The refrigerant is then routed from the outlet communication tube 67 to an outlet tube 68 which eventually discharges the refrigerant fluid from the housing at the outlet 53.
[073] This general architecture produces a basic form that can be adapted to present a compact structure that enables improved thermoelectric performance over a wide range of flow conditions (e.g. temperatures, fluid types, fluid flow rates) while relatively simple, versatile and potentially cost effective for numerous applications.
[074] In various embodiments, the housing is hermetically sealed under vacuum and its base blades 61 correspond with and press against the hot side surfaces of the thermoelectric layers 63. The base blades 61 of the housing may form a thermal interface (e.g. , be in thermal communication) with and generally slide along the respective inner surfaces of the casing blades. For some embodiments, in general, the thermoelectric layers may remain detached from the conformal shell.
[075] The compression and resulting contact pressures that arise along the respective interface(s) of the thermoelectric layer(s) and shell blade(s) may result from a differential pressure applied by vacuum produced over the upper and lower blades or portions of the housing. In this way, the pressure outside the housing (eg atmospheric pressure) can be greater than the pressure inside the housing (eg subatmospheric pressure, vacuum). In such an arrangement, uniform and relatively equal contact pressure distributions along the interface can be obtained, even if the surface of the thermoelectric layer is not perfectly flat because the shell laminae are thin enough to bend elastically and, in some cases, stretch without deformation. Such elasticity allows the blades to match the hot side surfaces of the thermoelectric layer(s). While for some embodiments, the cold side surfaces of the thermoelectric layer(s) are mechanically coupled to the heat exchanger, it can be seen that not every embodiment requires such a configuration. In that case, the pressure distribution applied by vacuum may also serve to compress and compress the internal components of the thermoelectric device so as to produce thermal interface contact pressures suitable for heat transfer at the other interfaces of the component as well.
[076] The concordance also enables the housing to adjust and continue to transmit well-distributed compressive pressures along the device's thermal interfaces, over a wide operating range of the device. The ability of the housing to slide relative to and/or physically correspond with the thermoelectric layers around which the housing is disposed allows dynamic compensation of the effects of thermal expansion, even at extremely high temperatures, which can include temperatures up to 700 degrees C. or more.
[077] Consequently, a conformal housing under vacuum, for example, provides a simple way by which to satisfy challenging requirements under relatively severe conditions, in order to obtain effective thermal interfaces, while also avoiding the use of clamping or compression mechanisms. conventional and bulky; such mechanisms may require structures that are relatively thick and bulky, so their attachment mechanisms (i.e. screws, springs, etc.) can adequately transmit force (often excessive but usually present) so as to distribute pressure , in a relatively uniform way, to the interface contact areas. As a result, these conventional approaches produce systems that are not very compact or lightweight.
[078] While the wrapper may include any suitable material, in some embodiments, the wrapper includes foils that are thin enough to elastically bend but not deform, allowing the foils to match, for example, the surfaces of thermoelectric layers. A variety of housing materials can be used, from plastics to metals, for example. Thin sheets can include one or more metals, as many metals have elastic properties up to a limit (eg, the strain limit).
[079] As described here, elasticity is the ability of a material to return to its original shape after being subjected to mechanical stress (eg bending, stretching). Additionally, thinning the blade to achieve shell compliance can also reduce the overall conduction path (e.g. thermal resistance) through the shell. This otherwise greater ability for heat to be conducted through the shell foil may improve the thermal performance of the shell for a given material and/or may enable the use of alternative materials that may have relatively lower thermal conductivity but have adequate properties. for appropriate applications (eg increased deformation resistance, corrosive resistance, etc.). Corrosion resistant materials for the housing and/or fins may be preferable for high temperature applications involving corrosive and oxidizing fluids, such as engine exhaust streams. A discussion of material options and fabrication and assembly capability is provided further below.
[080] Any fins attached to the casing can be designed so as not to restrict the conformation of the casing too much. One such embodiment of a fin arrangement, shown in Figure 9, involves several strips of fins joined to the base sheet of housing 61. In various embodiments, a strip of fins may include a strip of material that is formed into a form that appears as a waveform when viewed through the air inlet to the fins (ie square, rectangular, sinusoidal, etc. or a combination of these shapes). Such arrangements may also have louvers or other flow enhancements cut or added to the fin strips.
[081] The arrangement shown in Figure 9 is a rectangular square shape that is relatively tall, with shorter fin spacing (fins per inch), as depicted in the figures. This arrangement of fins includes repeated rows of fins on separate strips 55 which also exhibit a relatively short flow length (which lies in the direction of fluid flow), whereby an adequate amount of space exists between each row of fin strips. (i.e. spacing between fins) so that individual fin strips will not interfere with each other when the heat exchanger (e.g. conformal shell) matches a surface.
[082] In certain embodiments, the flow length of an individual fin strip must not be too long or it will otherwise add more rigidity than is desired to the heat exchanger (e.g. conformal housing), negating its agreement in this region. For many embodiments, a maximum flow length of approximately 1.30 cm (0.51”) can be used. Such fin arrangements allow the base blade to curve or reasonably match in any direction, including planes that are lateral, longitudinal, and those in between. This flexibility allows the base sheet of the housing with the finned highlights to match the substantially flat imperfect surfaces of the outwardly facing thermoelectric layers.
[083] Other embodiments of fin types that can be adapted for use for a conformal heat exchanger include pin fins and individual fins joining into a base blade (or fins formed with the base). For example, figure 10 conceptually represents the shell corresponding to the thermoelectric layer surfaces within the lateral plane showing two thermocouples (singular thermocouples) when they undergo significant deflection due to thermal expansion by the large temperature gradient across the supplied thermocouple. by the heat flow from the hot (top) side to the cold (bottom) side of the pair. (The deflections in figure 10 are visually exaggerated and magnified for visual perception.) Such thermal expansion, in some cases, causes the segmented ceramic to bend 'out of plane', for example, on the order of 0.00254 cm (0.001 ”). As conceptually shown, the base blade conforming to 61 (with the fin arrangement 55) is capable of substantially matching the contours of the non-planar surface of the single ceramics 5. Naturally, a base blade lacking the fins can correspond at least as well as, or better than, a finned base blade; however, the fins can be designed so as not to restrict the housing's fit too much.
[084] Another fin embodiment may use a plurality of metal or ceramic substrates, where each fin may be relatively narrow and tall, so as to be secured in a conforming shell and arranged in a formation, similar to that of fin formation. described above. For ceramic substrate formations, for some embodiments, the substrates may be metallized to secure in a metal housing. Such substrate formations can be used for a device after treatment (ie catalytic converters, diesel particulate filters). In this way, this modality can be used as an after-treatment device that also produces thermoelectric force.
[085] To further enhance the effectiveness of the thermal interface between the thermoelectric layer and the base sheet of the housing, a thermal interface material (not shown in the figures) can be inserted between the thermoelectric layer and the base sheet. For example, a thermal interface material may include a conformal graphite sheet, copper foil, carbon nanotube blocks and/or related materials, grease, among other options and may be inserted between the unique ceramics 5 and the blade of the housing base 61.
[086] As evident in Figure 6, the architecture of the device results in substantial symmetry around a horizontal plane that extends through the center of the refrigerant heat exchanger. This symmetry not only provides a simple and compact architecture, but also reduces the effects of off-leveling components. Out-of-level components may include distortions or deflections including surface components that no longer become level or parallel to each other, or when one or more of the components extend, or protrude, with respect to the other components, which would otherwise arise from the mechanical stresses due to the effects of thermal expansions resulting from significant temperature gradients across the assembly (eg, from hot shell to cold heat exchanger) within such a compact structure. Therefore, such symmetry still gives rise to an effectively flat interfacial set of components.
[087] In a variety of embodiments, the thermoelectric layers 63 are movable (e.g., sliding) with respect to the housing 51. In some embodiments, the heat exchanger (e.g., heat exchange section 64, communication tubes of inlet/outlet 66/67 and tube routing 68) is movable (e.g. sliding) with respect to the housing and, as shown in the cross section of Figure 6, a portion of the heat exchanger is also spaced from the housing. However, as further shown in Figures 7 and 8, other portions of the heat exchanger are not spaced from the housing. For example, tubes that route refrigerant from inlet 66 and outlet 68 through the side wall of housing 62 into refrigerant inlet 52 and outlet 53, respectively, pass through an opening in the housing for proper circulation of refrigerant therethrough. .
[088] The relative mobility between the shell, thermoelectric layers and heat exchanger allows adequate degrees of freedom during thermal expansions and contractions to avoid or otherwise reduce mechanical stress between components. For example, the hot shell (or hot heat exchanger) may be able to expand and slide freely along the thermoelectric layers, which reside in the cooler heat exchanger. Inlet tubing 66 and outlet tubing 68 that are secured in respective regions of the side wall of the housing 62, 63 can be connected in close proximity, which still allows the housing to thermally move and expand freely. Additionally, these fixtures may be located downstream in the device (with respect to the hot fluid flow), where the housing and fluid temperatures are cooler.
[089] In the planar direction (i.e. horizontal with respect to the cross section shown in Figure 11), which extends substantially along the broad surfaces of the base blades of the housing 61, as shown in Figure 11, the base blades of the housing 61 are configured to thermally expand with an increase in temperature relative to the heat exchanger and thermoelectric layers 63 (as indicated by the dashed arrows) and, in fact, the blades 61 are able to move and slide over the thermoelectric layers 63, which are in thermal interface contact with the base blades of the housing 61. As the base blades 61 slide along the thermoelectric layers 63, the base blades 61 adjust and continue to correspond with and apply thermal contact pressures distributed over the internal. It is observed that in Figure 11, optional fins are not shown for clarity in viewing other aspects.
[090] Perpendicular to the planar direction, the expansion distance of the casing (that of the side wall, shown as oriented along the vertical direction of figure 11) is much smaller due to its short height, resulting in little difference in thermal expansion between the housing and internal components when compared to the amount of thermal expansion in the planar direction. In many embodiments, the sidewall 62 may be more rigid than the base blades so as to produce a frame that supports the peripheries of the upper and lower base blades 61. In accordance with that structure, the conforming blades of the upper base and lower 61 compensate for the small thermal expansion (in a direction perpendicular to the plane defined by the upper and lower blades) by continuing to match and apply distributed thermal contact pressures across the trim.
[091] In some embodiments, a large vacuum is used to obtain a desirable degree of agreement and thermal interface contact pressures. A large vacuum that essentially results in the absence of a gas medium (or comparatively small presence of gas) also greatly eliminates convective heat transfer within the spaces between the thermoelectric structures, as well as between the housing and the refrigerant heat exchanger. . Otherwise, under certain operating conditions, such convective heat transfer could result in substantial thermal runoff(s), contributing to parasitic losses that degrade system efficiency. Additionally, if internal components (eg thermoelectric materials) are sensitive to oxidizing environments, a large vacuum can eliminate any need for an inert gas; however, it can be seen that if a partial vacuum is desired, an inert gas (eg nitrogen, argon) can also be used, eg to protect internal components, eg against oxidation.
[092] In various embodiments, where the housing extends or overhangs beyond the thermoelectric layers 63 and portions of the refrigerant heat exchanger 64, 66, 67, 68, the periphery of the housing provides a space to insulate and protect components within the volume. inside the housing.
[093] In some cases, structural reinforcements, such as a clamp, may be used to support the thin sheet of the casing in the projection region, which otherwise, in the absence of the clamp, may tend to deform, fail or disassemble. Other structural elements may provide clearances to position the internal components of the housing and limit their movement with respect to the housing, providing additional structural support for the device. Suspended radiation barriers, such as reflective aluminum foil, can also be used to reduce the transfer of thermal radioactive heat (another form of parasitic heat leakage) from the hot shell to the internals, such as to the exchanger's communication tubes. of heat. If desired, other types of structural reinforcements and insulators (ie aerogels, ceramics, etc.) may be used, which may depend on the fabricated design of the housing and/or whether or not a full vacuum is used.
[094] The thermoelectric layers can be integrated on opposite sides of a ceramic coolant heat exchange section, which is substantially flat. This construction conceptually resembles a two-stage thermoelectric module, whose cross-sectional view is shown in Figure 12. Here, in this embodiment, the upper ceramics are shown as being on the hot side and the lower ceramics are shown as being on the hot side. cold side. In such a module, two different thermoelectric layers 81, 82 are attached to either side of an intermediate flat solid ceramic 80. In one embodiment, a heat exchange section 64, which may be made of ceramic, metal, or other material, replaces the intermediate solid ceramic 80.
[095] A thermoelectric layer 63 incorporated in the thermoelectric devices described herein may include any suitable thermoelectric layer or sub-layer arrangement. In embodiments of the present disclosure, two similar high temperature thermoelectric layers 63 are mechanically coupled (e.g., rigidly clamped) on opposite sides of a flat ceramic coolant heat exchange section 64, as shown in Figure 13. As shown, the thermoelectric layers are integrated with a substantially flat heat exchange section. In this way, the thermoelectric layers 63 can be produced as one-stage, two-stage, or any other multi-stage module arrangement, including one or more sub-layers, and not every layer among a plurality of thermoelectric layers need be of the same design or materials. for a given device. The cold side interconnects of the thermoelectric layers 63 may be secured to the refrigerant heat exchange section 64 in any suitable manner, for example by metallizing the ceramic heat exchange section to the metallic interconnects 3.
[096] In some embodiments, high temperature thermoelectric materials 86, 87 mechanically couple (e.g., rigidly bond) to and are sandwiched between the interconnects while the unique ceramics 5 are metallized with and mechanically coupled (e.g., rigidly clamped) at the interconnections. hot side connections. Finally, a thermal interface material 84 (e.g. conformal graphite sheet, copper foil, grease, etc.) may reside on the outward facing surfaces of the singular ceramics 5 and may function to further increase thermal contact between the thermoelectric layers. and the wrapper.
[097] One embodiment where an integrated thermoelectric is fabricated may involve attaching the metal refrigerant inlet and outlet communication tubes to the corresponding inlet and outlet of the ceramic heat exchange section. In some embodiments, such attachment may involve metallization. One embodiment may include metallization using the material of the communication tube directly. Another embodiment may involve lightly metallizing the ceramic and subsequently joining the metal of the communication tube to the metallized ceramic, such as by brazing or other suitable technique. Metal communication tubes can then be joined in a metal housing to receive or expel the refrigerant.
[098] In another type of heat exchanger, a heat exchanger section with refrigerant and the communication tubes are composed of the same material, which can simplify the joining of these components by brazing or soldering. The thermoelectrics could be integrated into a metal heat exchange section, which may include an electrically insulating cover (not necessarily a ceramic cover) between the heat exchanger and the metal interconnects on the cold side of the thermoelectrics. Similarly, for some embodiments, a cover or electrically insulating material may be used between the hot side interconnects of thermoelectrics and the casing laminae, to secure bonded, bonded, or coated thermoelectric layers at the interconnects or lamina or as a separate lamina therebetween. .
[099] In contrast to thermoelectrics integrated into the refrigerant heat exchanger as described in one embodiment above, another embodiment may optionally include separating planar thermoelectric layers or modules simply placed in contact and on either side of a substantially flat refrigerant heat exchanger. , as shown in Figures 14 and 15, which represent high temperature modules with singular hot sides 90. This configuration can be aided by the thermal interface materials 84 on either or both sides of the module. In the illustrative embodiment of Figure 15, separate thermoelectric modules are in contact with a substantially flat refrigerant heat exchange section.
[0100] Another embodiment used with a ceramic coolant heat exchange section may include a mechanical clamping (e.g. joining, bonding) of the cold side ceramic to the ceramic heat exchanger to further improve the thermal contact resistance on the cold side. cold. Yet another embodiment may use separate thermoelectric layers or modules, but without ceramics on one or both sides, whereby on the side in the absence of ceramics, an electrically insulating layer (cover or separate sheet) is applied. Other miscellaneous embodiments may also be used by one skilled in the art.
[0101] Another type of enclosure, which has been described in a variety of embodiments, is a compressible or conforming enclosure sidewall, whereby one embodiment may take the form shown in Figure 16. It is noted that optional fins and locking mechanisms fixing are not shown in this figure for simplicity. Unlike a conformal vacuum shell, whereby the shell fill occurs at the interface between the trim and the base blade and less so on the sidewall, if any, the fill of a compressible shell can be effectively reversed. That is, for some embodiments, the base blade(s) may be less prone to agreement while the side wall(s) may exhibit a comparatively higher degree of agreement. In Figure 16, a thin substantially semicircular sidewall 77 can provide additional compliance or flexibility for differences in thermal expansion in the height direction (e.g. perpendicular to base blades 76 which are more rigid), while being able to withstand a high vacuum. , despite a relatively thin wall.
[0102] Also, similar to the other enclosures described here, the compressible enclosure produces an insulating and protective barrier for the internal components that include the thermoelectric layers in contact with a refrigerant heat exchanger (and associated components), and overlays the internals to the around the periphery of the housing, resulting in some space that is walled off by the flexible sidewall 77. Also, as described above, the housing may be movable with respect to the refrigerant heat exchanger to compensate for thermal expansion and contraction of the housing blade or the plate (in a direction parallel to the plates).
[0103] In a variety of embodiments, the compressible housing can be gas-tight, including modalities with high vacuum, partial vacuum with or without an inert gas, or simply with an inert gas. This vacuum serves similar purposes as described in the previous embodiments and still produces compressive forces to the internal component interfaces transmitted by the baseplate.
[0104] In some embodiments, compressive pressures greater than those created by a vacuum can be achieved with the addition of mechanical fasteners including screws, pins, springs in tension across the span, among others, which can be performed outside the weatherproof enclosure. of gas and not interfere with the seal of the housing. Among other embodiments, using such fasteners, reinforcement members that extend laterally across the tops of the fins produce additional structural reinforcement throughout the fin and baseplate structure to minimize baseplate deflection and actually produce pressures. well-distributed compression interface transmitted by the plates. In some embodiments, such reinforcing members may be periodically arranged, with any suitable geometric structure. For example, reinforcing members may be relatively wide or narrow relative to each other and arranged in an alternating wide and narrow configuration.
[0105] Other housing arrangements may not include a gas-tight compressible housing, allowing for simpler sidewall constructions. However, it may be preferable to use mechanically conforming structures in order to maintain the effective thermal interface between the sliding components for applications involving high temperature operation, in order to adjust for thermal expansions. For non-gas-tight embodiments, some of these constructions can range from attaching metal sidewalls or simply filling the enclosure with compressible insulation (which may still be a compressible version) or a combination of these approaches. For an incompressible or non-compliant enclosure (gas-tight or not), relative compliance between the internal components can be obtained, such as a compliant or compliant thermal interface block, which may have some elastic properties, among other options.
[0106] Enclosure with a compressible sidewall or non-compliant enclosure approach may have similar thermoelectric characteristics to that of the conforming enclosure. For example, the thermoelectric material may be integrated or mechanically coupled into the ceramic surface(s) or metal heat exchange section(s) of the heat exchanger or casing base blade(s). Or, entirely separate planar thermoelectric module(s) or layer(s) of other components may be used.
[0107] Additionally, in a variety of embodiments, the sidewall of the compressible shell or non-compliant shell approach may have the thermoelectric materials integrated into the hot side plates, whereby the cold side of the thermoelectric layer may be in sliding thermal contact. with the coolant heat exchange section, which can optionally incorporate a thermal interface material (e.g. thermal grease or foil). Such an integration would be similar to the method discussed earlier regarding thermoelectric integration in both ceramic and metal coolant heat exchange sections, except that these earlier integration approaches would be applied on the basis of the ceramic or metal heat exchanger on the hot side. . Also, the cold side of thermoelectric layers may include segmented ceramics 5, instead of the hot side, to alleviate thermal stresses.
[0108] As further described here, the thermoelectric device can be used for post-treatment purposes. As another embodiment, ceramic or metal heat exchangers on the hot side can also serve as a substrate to treat emissions in the hot fluid and function as a device after treatment, serving such purposes as a catalyst (e.g. catalytic converter ) or particulate filter. The housing, which may include a finned arrangement, may also include a cover configured to catalyze fluid reactions. These substrates can include many mini-channels and passages resulting in a lot of surface area which, in addition to catalytic surfaces, can also serve as heat exchange surfaces. Therefore, the thermoelectric device would serve a dual purpose: generating electricity and controlling emissions.
[0109] It can be seen that thermoelectric systems in accordance with the present disclosure can be adapted to include non-symmetrical arrangements. For example, an embodiment that is substantially cuboid in shape could only have a thermoelectric layer and a set of fins disposed to one side of the device and, on the opposite side, without fins and an insulator in place of the thermoelectric layer to produce a thermal barrier. between the housing and the internal heat exchanger. Other arrangements may also be possible.
[0110] In some embodiments, the thermoelectric device is substantially positioned within the interior volume of a duct that defines a flow space to house or otherwise confine a fluid (e.g., hot fluid flow stream) that surrounds and flows on the outside of the thermoelectric device. The duct may also include an inlet to accommodate the inflow of fluid into the flow space and an outlet to accommodate the outflow of flow out of the flow space.
[0111] As described here and represented in Figure 17, the interior volume or otherwise called the duct flow space is the outermost lateral dimensions of the volume containing the fluid when the fluid passes from the duct inlet to the exit. Although the thermoelectric device 50 may be positioned within the interior volume or flow space of a duct 40, the device may remain substantially separate from the duct components without the requirement for heat transfer to occur between the thermoelectric device and the duct components. ; in other words, the device's function does not require thermal communication with the structure (eg, duct) that confines the fluid surrounding the housing.
[0112] In some cases, the device may be optionally spaced or otherwise thermally isolated from the structure. The device can be spaced/thermally isolated from the frame, but need not be. Thermal insulation, in the context of the present disclosure, is not necessary to exclude mechanical attachment or coupling with the surrounding structure. Rather, thermal insulation is understood here to mean that the thermoelectric device is positioned relative to the surrounding structure, so that any thermal communication that occurs between the device and the structure does not substantially affect the thermoelectric operation of the device.
[0113] In contrast, in conventional thermoelectric devices, for thermoelectric conversion to occur, the devices need thermal communication (eg, being integrally coupled) with the surrounding structure (eg, the duct) that confines the fluid flow, so that a temperature gradient can be provided for the thermoelectric device. Otherwise, without such thermal communication (which produces an adequate temperature gradient), conventional thermoelectric devices would essentially not work for their intended purpose.
[0114] Conversely, embodiments of the thermoelectric devices described here can be formed separate and independent of the surrounding structure that confines the fluid flow stream. In this way, the thermoelectric device can be detachably attached to the duct and, in some cases, have only a few attachment points that can mechanically suspend the thermoelectric device within the internal volume or flow space of the duct through which the hot fluid flow.
[0115] Insertion of the thermoelectric device into a duct (e.g. vehicle duct, exhaust, etc.) is substantially similar to that of a heating core for a vehicle, except that here the thermoelectric device can be inserted into a heating duct. exhaust and may use the refrigerant to cool the device (instead of heating the occupant). For a passenger car application, Figure 18 depicts an embodiment for thermoelectric device 50 within a duct 40 that may require minimal contact with the duct. The device may be suspended within the duct using mechanical couplings (not shown in the figures) located on either side of the side walls 62 of the device housing.
[0116] As further described here, other than the inlet and outlet flow regions for the device, the remaining space between the device and the duct walls can be filled with insulation fill to eliminate any flow bypassing the device (also not shown in figure 18 for device visibility). Some embodiments are stand-alone thermoelectric devices, where the duct inlet and outlets can be connected with ductwork from the engine exhaust system that can include the muffler and/or after-treatment devices.
[0117] Since the device is complete and does not need to be heavily integrated with the duct that confines the fluid flow, the device can be considered modular. That is, the device can be easily incorporated into or removed from the overall system. Because of this modularity, a thermoelectric system that is scalable in capacity is easily obtained by simply arranging a plurality of thermoelectric devices in parallel and/or in series within the flow space of a duct or multiple ducts.
[0118] According to the thermoelectric device revealed here, various modalities can take the form of 10 devices in parallel and stacked vertically inside a duct, as shown in an example in Figure 24, where 5 kW of power would be delivered if each device generates 500W. Similarly, other embodiments may include a horizontal stack of 8 devices, as shown in an example in Figure 25, where 4 kW of power would be delivered if each device generated 500W. This system is also coupled with an inlet after treatment device that facilitates the transition from inlet flow to the duct while producing, overall, a very compact package.
[0119] Certain applications and embodiments may involve at least a portion of the fluid bypassing the device or bypassing a portion of the device. For example, in some cases, hot side fluid operating conditions may exist, which may, in certain cases, exceed acceptable temperature limits for the device, causing overheating and potential failure. In this way, a fluid bypass that reduces or stops the fluid flow over the temperature sensitive regions of the device can be utilized. In other cases, fluid flow may be excessive, creating too much back pressure, which may require flow relief. In any case, such a fluid bypass can serve to route some or all of the fluid flow through an alternate passageway that runs parallel to the fluid flow in the main duct, although such a bypass system can be implemented in a number of different ways. .
[0120] Certain embodiments of the fluid bypass system can use the space where the fin width ends laterally on either side of the device, between the housing and the duct, as seen in figures 17 and 18. For example, a partition wall Additional may be included where the fin width ends to define a separate flow passage for a bypass.
[0121] In some embodiments, a flow space that is substantially larger than the device can be utilized, where the device is spaced substantially to one side of the duct and a partition wall can be inserted adjacent to the device side, so defining a separate flow passage for fluid diversion.
[0122] Still, in other embodiments, a completely separate duct can generally be used, serving as the alternate passage of fluid flow. Here, fluid flow can be controlled using a damper or valve, activated actively (e.g. solenoid, motor, etc.) or passively (e.g. thermally activated material such as bimetal spring, shape memory alloys, etc.).
[0123] Variations of the aforementioned embodiments may include a plurality of devices, whereby deviation may be produced between adjacent devices.
[0124] In some embodiments, thermoelectric systems according to the present disclosure include one or more thermoelectric devices combined with noise dampening components, which may be designed and manufactured in a duct, or flow space confined by a duct, to function as both a silencer and a thermoelectric device, which is described here as a thermoelectric silencer. Such a combination is synergistic and achieved with relative ease.
[0125] The thermoelectric device, which may include thermoelectric arrangements according to various modalities, may already have aspects in it that attenuate noise. The thermoelectric device can also easily accommodate additional noise dampening features and materials. As described herein and understood to those skilled in the art, noise dampening components may include at least one noise dampening material, appearance or structure adapted to disperse, interrupt, dissipate or cause destructive interference from sound waves moving within a space. of fluid flow, including a plurality of passages, chambers, walls, perforated walls, tubes, perforated tubes or acoustically absorbing material and may or may not be an integral part of the device, duct or other components of the system.
[0126] A feature of the device that has certain advantages over conventional thermoelectric systems is that, for various embodiments, a substantial portion, if not the integrity, of the device's housing and any fins extending from it are facing outward and in contact. with the surrounding fluid, while remaining loose from the duct. In contrast, conventional thermoelectric devices require any such fins to be attached directly to the inner surface of the duct.
[0127] This feature of thermoelectric systems according to the present disclosure, where fins extending from the housing are able to remain detached from the inner wall of the duct, provides a relatively large surface area and volume (for example, particularly if the device is spaced from the duct) are available for the noise dampening components (e.g. located around the lateral periphery along the flow length of the device). The availability of additional surface area and volume can be beneficial for noise dampening, for example by accommodating the installation of noise dampening components. This arrangement allows the noise dampening components to be directly exposed to the sound waves of the fluid surrounding the device and, as such, can provide greater dampening of them. In accordance with various embodiments, the noise dampening components may be in mechanical contact with the device and/or the duct or neither.
[0128] Similarly, between an array of multiple thermoelectric devices within the flow space (e.g. within a duct), in a parallel or series array, noise dampening components can be arranged between portions of two or more such devices. For example, arrangements of multiple thermoelectric devices in accordance with the present disclosure may include perforations, an access tube or hole drilled within the immediate duct wall that produces one or more passages to other chambers or other noise dampening components. Such arrangements may also be adapted to muffle noise from other acoustics for regions located between thermoelectric devices that are arranged in series (eg thermoelectric devices located upstream and downstream with respect to each other).
[0129] In general, the fin model geometries are configured to interrupt the fluid flow (i.e., by the formation of fluid boundary layers) to increase heat transfer and thus play a role in noise dampening. . For a given fin model, a fin bank may have intermittent or periodic changes in fin geometry along the fluid flow direction (e.g. louvered, offset, perforated, wavy, etc.) and thus contain small flow passages. Additionally, shifting vane geometries from vanes with narrow sets of vanes, such as the one shown in the illustrative example of Figure 9, can produce a distinct change in cross-sectional area in the direction of flow. These characteristics can be effective in muffling noise, for example, by the dispersion, dissipation and destructive interference of sound waves. The housing surface can also contribute to noise dampening, for example by reflecting acoustic waves back into a surrounding fin bank, resulting in more absorption of wave energy. In some embodiments, the noise dampening components may be inserted within the fin banks, along the fins and fin arrays, and on top of the fins.
[0130] For a small profile rectangular or cuboid thermoelectric device, for example in the context of converting engine exhaust heat to power, the following may apply. It may be preferable for the fluid flow to transit between tubes having a certain cross section (e.g. round/circular tubes) - which may be typical of exhaust systems - and the cuboid thermoelectric device itself, through the inlet and outlet inside the duct. These inlet and outlet volumes can be easily adapted to function as reactive chambers by having tubes projecting/extending into chambers for greater reactive effects. To obtain a laterally balanced flow through the thermoelectric device (eg TEG), the inlet and outlet piping geometry axes can be arranged so that they are offset from each other. This feature can be conducive to reactive damping, since this configuration reduces the ability of sound to be transmitted directly from the inlet pipe to the outlet pipe, resulting in greater distances for waves to travel and opportunities for waves to be deflected and dissipated.
[0131] In some embodiments, the noise dampening techniques described here may be applicable in a thermoelectric silencer system for an automobile exhaust, which generates a noise signature across a very wide frequency range, for example due to a wide range of car engine speeds. Figure 22 presents an embodiment for this application, illustrating a thermoelectric device located within the space contained by a silencer. As such, the modalities described here have the potential to achieve broadband noise smothering like an automobile muffler and utilize similar noise smothering techniques and features such as those found in reactive and absorptive mufflers, including those listed in Figure 21.
[0132] In operation, exhaust gas and sound waves enter the inlet pipe 100 from the exhaust system connected to the engine. The exhaust immediately enters an expansion chamber 101 which is adapted to attenuate sound from the change in cross-sectional area; the concentrated wave entering the chamber from the inlet tube expands in the expansion chamber, having a comparatively larger volume and dissipating its energy across larger surface areas. Thus, this greater volume reduces the overall intensity of the wave.
[0133] The sound waves expand outward in the expansion chamber until they reach the side walls, where the exhaust sound is further attenuated by the reflection of the sound pulses off the side wall of the silencer, followed by destructive interference with the mufflers. subsequent nearby waves. Destructive interference is a reactive method of smothering that occurs when a sound wave interferes with another sound wave of equal or varying magnitude and phase and is typically achieved in lower frequency ranges (< 500 Hz) by forcing the gas through a series of chambers, tubes and passages. The bulge of the inlet tube 100 further aids in attenuation by allowing some waves to propagate in a direction opposite to that of the gas flow and reflect and dissipate against the front of the chamber, also allowing an additional opportunity for destructive interference.
[0134] A contraction of the cross-sectional area occurs as the exhaust gas enters the device and travels through the fin formations 55. The fin design shown here is generic but can be adapted to achieve high heat transfer and noise attenuation properties projecting frequent changes in cross-sectional area and small passes (on a mini- and micro-length scale) as sound waves propagate through the thermoelectric device, resulting in wave dispersion, dissipation and destructive interference. Such changes in cross-sectional area can include any suitable fin design, such as those shown previously in Figure 9, as well as perforated, staggered, louvered and wavy fins, among other types. Additionally, flow turbulence and boundary layer disruption can also dissipate sound wave energy. This type of attenuation can be particularly suitable for dampening low to mid frequencies.
[0135] As the exhaust flow moves through the fin formations, sound waves are often dispersed by the fins and reflected off the outer surface of the housing, directing the sound waves outward towards the periphery of the device and towards the perimeter of duct 104 (e.g., duct top, bottom, and side walls). In this way, the perimeter 104 of the duct can be lined with noise dampening components 102 (e.g. sound absorbing material including fiberglass) to dampen exhaust sound, as shown in Figures 22 and 23a. Any sound absorbing material can use absorbing material which reduces the magnitude of vibration for all frequencies, particularly at higher frequencies (>500 Hz) and are typically used in absorbing silencers. The sound absorbing material can also function as a suitable heat insulator that reduces heat loss through the duct walls and further increases the thermal performance of the thermoelectric device. (For visibility purposes, portions of the duct are not shown in the figures at the top and some of the sides and some sound absorbing material is also not shown on the top and left sides above the device. Also, the refrigerant inlet and outlet to and from the duct are not expressly shown in the figures for added figure simplicity.)
[0136] When the exhaust gas stream exits the fin formation of the thermoelectric device, an expansion of the cross-sectional area occurs in a second reactive chamber 103. Exhaust fluid flows into the second reactive chamber 103 before exiting through of the outlet tube, which may have any suitable cross-sectional shape (e.g. circular, rectangular, polygonal, etc.), where the fluid experiences a contraction of the cross-sectional area. The reactive chamber 103 can also attenuate low frequency sounds by reflecting the sound pulses off the rear wall of the muffler. This reflection of waves creates destructive interference. The outlet tube can also protrude into the chamber (not shown in the figures), which can also provide a barrier to keeping sound waves from leaving the system.
[0137] Instead of, or in addition to, the noise dampening components 102 being located between the thermoelectric device and the inner surface of the duct (e.g. along the flow length of the device), as shown in Figures 22 and 23a, alternative noise dampening components may be used, for example, including one or more fluid passages, chambers, walls, or perforated walls. Figure 23b shows chambers within the interior space of the duct that form two extended reactive chambers 120 (upper and lower regions of the duct), extending from the inlet chamber of the expansion 101 to the outlet chamber 103.
[0138] Similarly, in another embodiment, a reactive chamber extending to the outlet chamber of the expansion 103 may be formed by simply opening the chamber extending to the outlet chamber 103 and placing a wall in an opening to the inlet chamber 101. An embodiment The variation is shown in Figure 23c , which represents two isolated reactive chambers 121 in the upper and lower regions of the device, which are constructed to interact acoustically with the sound waves having traveled between the fins at medium length.
[0139] For certain embodiments, as shown in Figure 23d, the system may include additional aspects, for example where multiple thermoelectric devices are arranged within a duct 104. The multiple devices 50 (not necessarily cuboid) within the duct 104 - or other thermoelectric devices 128 which can be inserted into a space of the duct 104 - can be arranged within a larger housing chamber 125 which can also route the gas from the housing inlet through the duct 104 with the thermoelectric devices 50 or 128 and to the housing chamber. The housing chamber may provide an optionally perforated gas outlet tube 125, which may optionally protrude substantially into the housing chamber and be oriented to be substantially parallel to the duct # and extend over a substantial portion of the distance from the chamber. .
[0140] In some embodiments, the inlet and outlet volumes between the exhaust pipes and the thermoelectric device that are formed by the duct containing the device can be extended to include a variety of silencer components. As the muffler and housing constructions are often cuboid in shape, aspects of the thermoelectric muffler system described here can easily be matched to them. Similar approaches can be used for after-treatment devices (eg catalytic converter, diesel particulate filter, etc.). As presented herein, the systems and methods in accordance with the present disclosure can reduce the flow transition pressure drop and/or the total volume confined by the device and silencer (and/or from the device to after treatment) that would otherwise would occur with separate components. As an example, Figure 25 represents a horizontal stack of 8 devices to deliver 4 kW of power into a duct that may also utilize components and noise dampening aspects to serve as a thermoelectric squelch system. The after treatment device (eg catalyst) is located at the inlet, which facilitates the transition from the inlet stream to the duct while also presenting a very compact package.
[0141] The revealed thermoelectric silencer system (with inlet or outlet after optional treatment) has the potential to significantly reduce the overall size, weight, back pressure and cost of a heat recovery exhaust system when compared to systems where the thermoelectric device and silencer would otherwise be separate. By effectively combining a thermoelectric device and a muffler, this approach reduces and/or can eliminate the need for a separate muffler.
[0142] It can be verified that any suitable thermoelectric device(s) can be placed within an appropriate, optionally enclosed flow space (e.g. exhaust pipe, duct, silencer, etc.) and are not limited to the specific modalities of the thermoelectric devices described here. For example, the above description relating to a thermoelectric silencer incorporating various embodiments of the thermoelectric device within a duct may be applicable to any suitable thermoelectric device (e.g. substantially cylindrical, cuboid, combination of both, among others), whereby a portion substantial, if not integrity, of the thermoelectric device and any thermally conductive component(s) (e.g. fins or other geometries) extending therefrom is disposed within the flow space (e.g. in contact with the surrounding fluid), while optionally remaining loose in the duct. For example, a plurality of thermoelectric devices 128 (e.g. cylindrical shaped is shown here) may be arranged in an arrangement as shown in Figure 23e whereby noise dampening components 102 may be located between the thermoelectric device and the inner surface of the duct (eg along the flow length of the device). Or, other types of thermoelectric devices may be placed within a fluid flow space, as appropriate.
[0143] Similarly, it is to be understood that embodiments of thermoelectric devices of the present disclosure may be integrated or otherwise used with any thermoelectric system. As mentioned above, embodiments of the thermoelectric device can be placed, for example, within the flow space of a duct or device for after treatment or silencer. However, the thermoelectric devices described here can be incorporated into other types of relatively high temperature systems.
[0144] In conjunction with the thermoelectric systems/devices presented here, or for other applications that do not use thermoelectrics, it may be beneficial to use a heat exchanger conforming to, thermally communicating with, and sliding along a structure (e.g. , thermoelectric layer(s), internal heat exchanger(s) that the heat exchanger surrounds or is otherwise adjacent to. In various embodiments, such a conformal heat exchanger may simply be a conformal surface, blade, or wall, the outer surface of which has been adapted to enhance heat transfer with the environment (e.g., via a plurality of fins extending from the housing). The fin type and design may be utilized so as not to greatly restrict the heat exchanger's ability to substantially match and perform as the particular application at hand requires. (More on fins for conformal blades or housings are discussed in previous sections.) In some embodiments, in accordance with the aspects described here, the conformal heat exchanger is a conformal housing that surrounds one or more thermoelectric layers and/or heat exchangers. additional.
[0145] While aspects of such a heat exchanger as may include the base blade of an enclosure or other aspects thereof, including noise dampening components in the vicinity of the heat exchanger, certain elements are not required for all embodiments of the present disclosure. . In some cases, the structure having a shape that the heat exchanger conforms to does not have to be thermoelectric layers, but may include any suitable structure, including one that changes shape itself.
[0146] Also, although the surface of the structure can be connected in a housing, such connection is not necessary for many embodiments. Furthermore, it is not necessary in each embodiment that the slipping between the components be caused by the thermal expansion of the conforming surface or any component(s) to which the surface is coupled.
[0147] The compressive pressure that causes the heat exchanger to match and interface with an adjacent structure may be produced by a vacuum (eg, depressurized from atmospheric pressure) on one or more sides or another method. For example, a portion of the surface can be mechanically pulled (eg creating tension) or a suitable pressure differential can be generated across the heat exchanger. A pressure differential can be obtained by methods other than the vacuum, for example, the pressure of the surrounding environment can be increased to above atmospheric pressure, either under the sea or inside a pressurized component, container/vessel, or machine, among others.
[0148] The conformal heat exchanger may also transfer heat intermittently or with varying thermal effectiveness to the adjacent structure due to varying compressive pressures or variation of any substance at the interface - thermal, anti-friction or otherwise (i.e., block of graphite, fluid, grease, oil, etc.) - that may be in between.
[0149] In conjunction with the thermoelectric systems/devices presented here, or for other applications that do not use thermoelectrics, a solid state thermal switch can reduce the ability of a structural member to conduct heat (e.g. reduce effective thermal conductivity of the structural member) when its temperature rises above a given value. This ability for thermal conductivity to be modulated can provide applications with operational control, such as protecting components from overheating. One application where the modalities of a thermal switch can be incorporated is in a heat exchanger, where the effective thermal conductivity of the heat exchanger can be reduced in response to a rise in heat exchanger temperature above a certain threshold or value. cutting.
[0150] Such a heat exchanger incorporating a thermal switch can be used to protect the thermoelectric material(s) in relatively high temperature applications where the thermoelectric material(s) is unable to operate above a threshold temperature without failure. Here, the heat exchanger transfers heat to the temperature sensitive thermoelectric material(s), however, the heat exchanger may reduce its effective thermal conductivity near the interface with the thermoelectric material(s). In this way, the temperature of the thermoelectric material(s) can remain at temperatures below the threshold temperature, for its protection. Although in some cases the effective thermal conductivity of the heat exchanger is reduced, thermoelectrics may still be able to perform their function as long as the thermal switch built into the heat exchanger can be configured to transfer some of the heat to the heat exchanger. and thermoelectrics above the threshold temperature.
[0151] As mentioned above, many thermoelectric materials are not able to perform in a proper manner at excessively high temperatures (e.g. any point between 500 to 650 degrees C and above is typical) and can be protected using thermal switch technology. thin solid-state heat exchanger, described here, which can be integrated into any suitable heat exchanger, e.g. in its base
[0152] A basic function of thermal switches according to the present disclosure is to reduce thermal conductivity by causing the fluid to undergo a phase change. The fluid can change state from a liquid to a gas (eg at a boiling or vaporization or evaporation temperature) corresponding to a desired threshold temperature. In a gaseous state, most fluids exhibit much lower thermal conductivities than in a liquid state.
[0153] When implemented in systems described here, this fluid can be adequately contained in passages (e.g. channels, mini-channels, microchannels, grooves, spans, among other options) within a solid member, where the effective thermal conductivity change of the fluid is desired. The construction and location of passages may depend on the application, but are not limited to any particular configuration or structural application.
[0154] For applications involving hot side to thermoelectric heat exchangers, in a variety of embodiments, a thin thermal switch can be incorporated within an inner surface of the base blade or plate 61 of the hot side heat exchanger, as referenced in figure 26.
[0155] As shown in Figure 27, small passages, such as microchannels 112, can be formed in the base sheet or plate 61, filled with an appropriate fluid or fluid composition, and closed by securing a thin cover sheet 110 over the surface. fluted. Here, in this illustrative embodiment, the microchannels are etched into the base blade 61.
[0156] Figures 28a and 28b show partial cross-sections of closed fluid channels. Here, in this illustrative embodiment, a fluid composition is closed within microchannels of a thermal switch and the fluid composition is shown changing state and conductivity. Figures 28a and 28b also show a conceptual comparison of the thermal switch before and after it changes state, corresponding with a higher conductivity in its liquid phase and a lower conductivity in its vapor phase, respectively.
[0157] In several modalities, the formation of channels in the base blade can be performed through mechanical machining, chemical etching or stamping, among others. For a metal heat exchanger, fixing the thin blade to the surface can be accomplished through a variety of methods including brazing, diffusion bonding, soldering, and so on. While incorporating a thermal switch, the composite base and thin blades can be configured such that the overall thickness is still thin enough to function as a conformal shell. Microchannels offer a very thin compact approach to utilizing the thermal switch and can be made to be very shallow, minimizing or otherwise reducing the length of the thermal conductance path to transfer heat, which may be desirable.
[0158] Instead of forming microchannels, a variety of other modalities can be used. For example, a thermal switch may include a depression formed within the base or blade of the housing cover in which a thin screen or frame is placed therebetween so as to withstand interfacial pressure(s) (and/or a partial vacuum within of fluid passages) while allowing fluid to migrate or flow through the entire fluid volume.
[0159] In various embodiments, the fluid within the passages can be contained in a closed passage volume, whereby the passage pressure can be adjusted or tuned to change the boiling point temperature of the fluid (i.e. the threshold temperature or key cutting).
[0160] While in some cases the fluid may reside entirely within the heat exchanger, in another embodiment a tube (e.g. capillary tube) may be attached to the passage so as to extend the passage and fluid out of the heat exchanger, for ease of access for filling with fluid (eg for refilling or maintenance) and pressurizing or depressurizing the passage.
[0161] Another embodiment may include a bulb 111, as shown in Figure 26, which adds more volume to the fluid passages, which increases the design versatility with this approach. Although Figure 26 shows the bulb inside the housing, other embodiments may use the bulb outside the housing. These appendages, in some embodiments, may be relatively rigid to withstand high, low, or vacuum pressures. Within the rigid bulb, other embodiments may include a compressible diaphragm filled with a different fluid (or similarly functioning component), which reduces its volume in response to the fluid expanding as the fluid changes state.
[0162] In other embodiments, the bulb may be flexible to accommodate the expanding fluid as it transitions from liquid to gas. Additionally, a flexible bulb is able to balance its pressure from the inside passage to the outside pressure; consequently, for a bulb inside a vacuum housing for the thermoelectric device, the vacuum pressure level within the housing can be tuned appropriately to adjust the thermal switch pass pressure and, in turn, the switch cut-off temperature. .
[0163] In certain embodiments, a plurality of separate thermal switches with or without bulbs (or tube extensions) may be arranged within a heat exchanger or blade. In various embodiments, a switch may be positioned at or near the inlet region of the heat exchanger and additional switches may be located along other regions of the heat exchanger. The switch(s) can respond properly when hot gas temperature flows through the device, or fluid heat exchanger, from one end (inlet), losing heat and reducing temperature, to the other (outlet). In this case, thermal switches can be used to close the input, by activating those switches which are located downstream beforehand. Also, some thermal switches within the plurality can be set to activate at different threshold temperatures than others, corresponding with different thermoelectric materials and their different temperature sensitivities.
[0164] A variety of fluids can be used for the thermal switch, including sodium and potassium and their alloys such as NaK, among others. These substances have substantially high liquid thermal conductivities and boiling points in the range of 500 to 650 degrees C for vacuum pressures - the appropriate temperature range to protect thermoelectrics for engine exhaust applications. In other embodiments, fluid mixtures with more than one fluid type can be used to fine-tune the thermal switch performance. The fluids can also be pure, binary, tertiary, among other fluid compositions.
[0165] For a thermoelectric engine exhaust device, the thermal switches described here consider unnecessary a bulky exhaust gas bypass passage activated by an on/off damper, which was the industry proposed solution for conventional thermoelectric systems to protect thermoelectric materials. The inherent compactness of the thermoelectric device, the thermal switch (which eliminates a separate bypass), and the integration of the muffler material (which can eliminate a separate muffler) make this device technology and its associated systems attractive for vehicle applications.
[0166] In conjunction with the thermoelectric systems/devices presented here, or for other applications that do not use thermoelectrics, a thermal interface compound is revealed. The thermal interface compound includes two or more substances that can improve thermal interface contact (eg, effective thermal conductivity) between two sliding surfaces than with only one substance or none at all. One application which may have such sliding surfaces, and where the thermal interface compound may be incorporated, is within an embodiment of a thermoelectric device.
[0167] The conventional approach to reducing the resistance of thermal contact between the sliding surfaces of components is to introduce a thermal interface material 84 between the surfaces, such as a sheet or block of conforming graphite, copper foil, other metal sheets , carbon nanotube block, thermal grease, among others. Solid thermal interface materials can at least partially match and help bridge gaps that exist between sliding surfaces and typically have better thermal conductivities within the solid than a thermal liquid or grease; however, solid thermal interface materials introduce two contact sides of the interface, which can inherently introduce more thermal contact resistance and can significantly diminish the benefit of thermal interface sheet. Although a liquid or grease interface substance typically provides more desirable contact with surfaces (e.g., lower thermal contact resistance), if applied alone at an interface that has significant spans, the lower thermal conductivity of the liquid or grease may not result in better thermal performance than a solid sheet.
[0168] The approaches according to the present disclosure to the thermal solid interface compound use a combination of a solid conforming material with a liquid or grease on either or both sides of the sheet to reduce the overall thermal interface strength between the sheets. two sliding surfaces - in other words, resulting in greater effective thermal conductivity across the interface of the two surfaces than with just one of the substances (eg foil or grease). Conform, in this particular case, is in reference to the material having greater elastic properties than the solid components that make up the interface (i.e., located on either side of the material) and sandwich the conformal sheet. The conformal material or sheet can bridge the larger gaps between the two sliding surfaces which can be on the order of mini to microscale, while the liquid adheres to the surfaces and can bridge the gaps on the order of micro to nanoscale. The second component does not have to remain liquid at all times, however. A substance that changes phase from solid to liquid once the device reaches a desired operating condition would also suffice, such as a tin film or solder.
[0169] This thermal interface composite approach also reduces the possibility of 'pumping out' of the liquid during the thermal cycle, which results in the liquid migrating out of the interface leaving the air gaps, due to cyclic thermal deformations of the surfaces of the thermal interface. interface during the thermal cycle.
[0170] One embodiment may include a conforming graphite sheet with a thin layer of grease on both sides of the sheet. Experiments were conducted comparing this modality with a single sheet of graphite and the results showed that the overall thermal contact resistance can be reduced by as much as 40 to 50 percent at low contact pressures of 103.4 kPa (15 psi) when compared with systems where the foil was used without the grease (ie, interfacial makeup). For higher contact pressures, the percentage reduction in thermal contact resistance decreases.
[0171] While some reference to the materials, construction and fabrication of a variety of embodiments has been mentioned in the previous sections, particular attention and detail is provided here describing the fabrication of the conforming vacuum housing and its assembly with the remaining thermoelectric device where related shaped like a rectangular cuboid with a small profile. For this approach, although many designs for the manufacturing and assembly processes exist and can be properly used, only a number of representative examples are presented here.
[0172] A wide variety of housing materials can be used including metals and certain plastics (depending on the temperature of the hot fluid in the application), among others. However, corrosion resistant metals may be preferred so as to withstand corrosive engine exhaust streams and high temperature oxidizers for long periods of time (eg many years).
[0173] In some embodiments, the shell foil and/or fin materials may include oxidizable acid, nickel-based alloys (eg, inconel), molybdenum, and titanium, among others. The casing blade and fins can be thin enough to produce a desirable degree of elastic compliance under vacuum, while also producing considerable combustion exhaust gas corrosion resistance and strength, which can be particularly useful for the base blade. .
[0174] Methods of joining between the fins and the housing can include brazing, brazing and diffusion bonding, among others.
[0175] As shown before, Figure 10 shows a conceptual example of the agreement described above, for surfaces of the thermoelectric layer. Additionally, experiments were conducted that verify the agreement of such a semi-elastic structure, including a prototype of a thermoelectric device, similar to the shape in figure 19.
[0176] To manufacture the shape of the housing, one embodiment may include the welding of a cuboid-shaped box, into which the internal components are inserted. In one example, a similar box design housing design, as shown in Figure 19, was fabricated for a thermoelectric prototype, including the base blade conforming to 61 welded to the sidewall 62 or frame. After this box shell was made, the internal components (eg heat exchanger, thermoelectric materials, etc.) were inserted into the open end of the box, which was subsequently walled off and sealed in a similar manner. This prototype and build project has demonstrated success by being airtight with a high vacuum produced in it. Additionally, this thermoelectric prototype worked as intended including the housing as functioning properly as disclosed here - for gas flow air temperatures up to 600 degrees C (which was the limit the test supported) and probably higher temperatures. This prototype has a smaller footprint than a passenger car, but similar height dimensions.
[0177] The short cuboid shape of the described embodiments allows for other fabrication approaches that are much easier, however. A variety of embodiments may include two wide blades or halves that are drawn or stamped to form the relatively shallow height/depth within the base blades 61 (without a separate sidewall 62), similar to a clam shell configuration, as shown. in figure 20 as cross-sectional views, which show two possible formed options. The base blades 61 for the upper and lower regions of the housing can be drawn together at their periphery so that they meet to form a seamable interface between the two base blades or halves, which can eliminate any need the inclusion of a side wall separate from the housing.
[0178] The internals - e.g., refrigerant heat exchanger 64, thermoelectric layers 63, structural supports 69 and other components (not explicitly shown) reside within the space enclosed by the two halves.
[0179] Possible joining approaches may include brazing, brazing, soldering, among others. Mechanical coupling by other methods of fixing, locking, tightening, sealing, among others, can be used together with a gasket or other sealing methods.
[0180] The clam shell approach can be advantageous as this configuration does not involve as many parts as other configurations (eg only the upper and lower halves can be used). In the clam shell approach, the joint between the joined parts is not long, so the risk of joint failure is reduced. In addition, the vacuum within the housing can be pulled after the housing is sealed.
[0181] Having thus described various aspects of the various embodiments of the present disclosure, it should be appreciated that various changes, modifications and improvements will readily occur to those skilled in the art. Such alterations, modifications and improvements are intended as part of this disclosure and are intended to be within the spirit and scope of the invention. Accordingly, the foregoing description and drawings are by way of example only.

权利要求:
Claims (22)
[0001]
1. Thermoelectric device, comprising: at least one coolant heat exchanger (64), having a first side and an opposite second side; a first thermoelectric layer (63) in thermal communication with the first side of the at least one refrigerant heat exchanger (64); a second thermoelectric layer (63) in thermal communication with the second side of the at least one refrigerant heat exchanger (64); and a housing (51) surrounding the first and second thermoelectric layers (63) and the at least one refrigerant heat exchanger (64), the housing (51) providing a barrier to the first and second thermoelectric layers (63) and the fur. at least one refrigerant heat exchanger (64) from a fluid located outside the housing (51), CHARACTERIZED in that a portion of the housing (51) is adapted to conduct heat and is in thermal communication with the first and second layers thermoelectric plants (63) and wherein the at least one refrigerant heat exchanger (64) is movable with respect to an inner surface of the housing (51) in order to accommodate the thermal expansion of the at least one refrigerant heat exchanger (64) and the housing (51).
[0002]
2. Device, according to claim 1, CHARACTERIZED by the fact that the housing (51) comprises upper and lower base blades (61) in thermal communication with the first and second thermoelectric layers (63), respectively, and in which portions of the upper and lower base blades (61) elastically conform to the first and second thermoelectric layers (63) to achieve thermal contact and dynamically compensate for thermal expansion.
[0003]
3. Device according to claim 2, CHARACTERIZED in that it further comprises a plurality of fins (55) extending from an outer surface of the conformable portions of the housing (51), the plurality of fins (55) spaced apart so that the individual fins (55) can move relative to each other and allow the upper and lower base blades (61) to conform elastically.
[0004]
Device according to claim 3, CHARACTERIZED in that the plurality of fins (55) comprise repeated rows of separate strip fins having a short flow length, which is in the direction of fluid flow.
[0005]
5. Device, according to claim 2, CHARACTERIZED by the fact that the housing (51) comprises a shell-shaped arrangement, in which the upper and lower base blades are engageable and connected to each other and arranged opposite and parallel to each other.
[0006]
6. Device, according to claim 1, CHARACTERIZED by the fact that the housing (51) comprises upper and lower base blades (61) in thermal communication with the first and second thermoelectric layers (63), respectively, and a wall side (62) that extends the distance between the upper and lower base blades (61).
[0007]
7. Device according to claim 6, CHARACTERIZED by the fact that the side wall (62) is compliant to dynamically compensate for thermal expansion.
[0008]
8. Device, according to claim 7, CHARACTERIZED by the fact that the side wall (62) is semicircular in shape.
[0009]
9. Device according to claim 1, CHARACTERIZED in that it comprises a compliant thermal interface material (84) disposed between the housing (51) and the first and second thermoelectric layers (63) or between the at least one exchanger heat exchanger (64) and first and second thermoelectric layers (63) to dynamically compensate for thermal expansion.
[0010]
10. Device, according to claim 1, CHARACTERIZED by the fact that the pressure inside the housing (51) is maintained at a pressure lower than the pressure outside the housing.
[0011]
11. Device according to claim 1, CHARACTERIZED in that it further comprises a plurality of fins (55) extending from an outer surface of the housing (51) to improve heat transfer to the housing (51) ).
[0012]
12. Device, according to claim 11, CHARACTERIZED in that the thermoelectric device (50) further comprises at least one reinforcing element in communication with the plurality of fins (55) to add structural reinforcement.
[0013]
Device according to claim 1, CHARACTERIZED in that at least a portion of the device (50) is adapted to treat emissions from the heated fluid and to function as an after-treatment device.
[0014]
14. Device according to claim 13, CHARACTERIZED in that the thermoelectric device (50) further comprises a plurality of fins (55) arranged on an external surface of the housing (51) of the thermoelectric device (50) to improve the heat transfer to the housing (51) and wherein the fins (55) function as the after-treatment device.
[0015]
15. Device according to claim 1, CHARACTERIZED in that it comprises an inlet (52) for the refrigerant fluid to flow to the refrigerant heat exchanger (64) and an outlet (53) for the refrigerant fluid to flow from the refrigerant heat exchanger (64), wherein the inlet (52) and outlet (53) pass through the housing (51) in close proximity to each other to achieve limited thermal expansion therebetween.
[0016]
A thermoelectric system comprising: a duct (40) defining a flow space housing the fluid as defined in claim 1 the duct (40), having an inlet arranged to accommodate entry of fluid into the flow space and an outlet arranged to accommodate fluid outlet out of the flow space; and CHARACTERIZED in that the thermoelectric device (50) as defined in claim 1 is arranged in the flow space.
[0017]
17. Thermoelectric system, according to claim 16, CHARACTERIZED in that it further comprises at least one noise dampening component (102) or after-treatment device.
[0018]
18. Thermoelectric system, according to claim 17, CHARACTERIZED in that it further comprises a plurality of fins (55) arranged on an external surface of the housing (51) of the thermoelectric device (50) to improve heat transfer to the housing (51) and to dampen sound waves traveling in the flow space.
[0019]
19. Thermoelectric system according to claim 17, CHARACTERIZED in that at least one noise dampening component (102) is arranged within the flow space between a portion of the thermoelectric device (50) and an interior surface of the duct (104).
[0020]
20. Thermoelectric system, according to claim 17, CHARACTERIZED in that it further comprises a second thermoelectric device (128) arranged in the flow space, in which the thermoelectric device (50) and the second thermoelectric device (128) are configured in series or parallel arrangement and wherein the at least one noise dampening component (102) is disposed between the thermoelectric device (50) and the second thermoelectric device (128).
[0021]
21. Thermoelectric system, according to claim 16, CHARACTERIZED by the fact that the duct comprises an expansion chamber (101), a reactive chamber (103) and a middle part arranged between the expansion chamber (101) and the chamber reactive (103), wherein the thermoelectric device (50) is disposed in the middle portion, and wherein the thermal fluid flows through the inlet (100) into the expansion chamber (101), the expansion chamber (101) having a larger cross section than the inlet (100), and passes over the thermoelectric device (50) and enters the reactive chamber (103), before exiting through the outlet, the outlet having a smaller cross section than the reactive chamber (103).
[0022]
22. Thermoelectric system, according to claim 16, CHARACTERIZED by the fact that a silencer component or an after-treatment component is disposed in an inlet volume (101, 120, 121) of the flow space in which the fluid enters or an exit volume (103, 120, 121) of the flow space from which the fluid exits.

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法律状态:
2018-11-13| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|

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2020-03-31| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|

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2021-03-16| B06A| Patent application procedure suspended [chapter 6.1 patent gazette]|

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2021-11-16| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|

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2022-01-25| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 15/03/2014, OBSERVADAS AS CONDICOES LEGAIS. |

优先权:

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申请号 | 申请日 | 专利标题

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US201361801105P| true| 2013-03-15|2013-03-15|

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US61/801,105|2013-03-15|

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PCT/US2014/030031|WO2014145293A2|2013-03-15|2014-03-15|Thermoelectric device|

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